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Sputtering Target
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Sputtering Target

image photo - We manufacture Target Materials for Sputtering in Disk and Square shapes.
- Special specifications such as bonding process, development of
alloy target or other shapes are available.

GOLD Target

Sample:
L/ Au Φ320×7 mm
R/ Ag Φ101.6×5 mm, Bonding process
 
Sample:
L/ Ag 900×300×25 mm
R/ Au 260×150×6 mm

 Size Disk Varied (Max Φ350×7 mm)  
Square Au Varied (Max 500×150×7 mm)  
Ag Varied (Max 1500×300×35 mm)  
 Grade Au:4N, 5N Ag:4N
Others
 

• High quality target without pinhole, burr or chipping
• Available for machining such as hole drilling or chasing for fixture
• Highly accurate bonding process by ultrasonic flaw detection
• Collect/reprocess of used targets available

All specifications are samples from past achievements.
Any shapes such as bar, wire, chip or other special shape and size are considerable.
Grades are described in the following terms. 4N : 99.99%, 5N : 99.999%, 3N5 : 99.95%.
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